SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明

SMD3225 TXC差分晶振156.25MHz电气参数介绍如下:

FACTORY(生产工厂):TXC

OUTPUT WAVEFORM(输出波形):LVPECL

TXC P/N(TXC料号): DBA5600011

PRODUCT TYPE(产品类型): SMD LVPECL CXO 3.2mm*2.5mm

  • ELECTRICAL SPECIFICATIONS(差分晶振156.25MHz电气参数)

SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明

Note1 Inclusive of frequency tolerance at 25degC , variation over temperature, supply voltage variation, aging and vibration.
Note 2 Output will be enable if OE is Logic 1 or open ; Output will be disable if OE is Logic 0.
Note 3 The standard testing environment except temperature test is 25+5degC,40%~70% relative humidity.

  • TESTING CIRCUIT(差分晶振156.25MHz测试电路)

SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明

Testing Circuit Note:
1) Above testing circuits cover all the specifications except temperature test & Jitter measurement.
2) All the testing equipments are 50 Ohm terminal.
3) OE terminal is open connection except OE function test.

  • WAVEFORM CONDITONS(差分晶振156.25MHz波形示图)

SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明

  • DIMENSIONS(差分晶振156.25MHz尺寸)

SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明

  • SUGGESTED REFLOW PROFILE(差分晶振156.25MHz回流焊作业建议)

SMD3225 TXC差分晶振156.25MHz LVPECL规格书及使用说明
Note 1: Period while temperature exceeds the solder melting point : 220℃ should be less than 200 sec.
Note 2: Period while temperature stays at the top melting point : 260℃ should be less than 30 sec.

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