晶诺威科技产晶振产品可靠性测试项目及标准Reliability Test
- 抗焊热 Resistance To Soldering Heat Test MIL-STD-202G Method 210F
- 高温储藏 High Temperature Storage MIL-STD-202 Method 108
- 低温储藏 Low Temperature Storage JIS C7021:B-12
- 温湿度试验 Moisture Resistance Test JIS C7021:B-11
- 自由落下试验 Free Drop Test JIS-C0044
- 震动试验 Vibration Test MIL-STD-883F: 2007.3
- 盐雾试验 Salt Atmosphere Test Vacuum Drying Oven
- 温度循环试验 Temperature Cycling MIL-STD-883F-1010.8 Condition B
- 动能老化 Aging Biased MIL-STD-202G Method 108A
- 冷热冲击 Thermal Shock MIL-STD-883F:1011.9 Condition B
- 可焊性试验 Solder Ability Test(SMD) MIL-STD-883E Method 2003.7
- 机械动能 Mechanical Shock MIL-STD-883F: 2002.4