关于晶振使用中的常见问题，晶诺威科技归纳及解释如下：

Common problems include the build up of contaminants on the PCB, hermetic seal fracture, and issues caused by an inadequate soldering process.

常见问题包括PCB上的污染物堆积、晶振气密密封破裂以及焊接工艺不当造成的问题。

PCB contaminants, like flux, humidity, and finger prints, can reduce the impedance between nodes, which in turn can create a number of issues. To overcome this problem, check for contaminant accumulation between the crystal leads and beneath surface mount technology (SMT) devices.

PCB污染物（如焊剂、湿度和指纹）会降低节点之间的阻抗，因此引发许多问题。要解决此问题，请检查晶体引线和表贴（SMT）器件下方是否存在污染物。

Although uncommon, it is possible for a crystal’s hermetic seal to fracture. This would allow moisture and other contaminants to infiltrate the case, causing sporadic operation or complete failure. To avoid this problem, the crystal should be handled carefully and its case should be adhered to the PCB. A small SMT-type crystal is recommended.

虽然不常见，但晶振气密密封可能破裂。在水分和其它污染物渗透的情况下，造成晶振工作异常或停振。为了避免此类问题发生，请针对晶振产品严格遵循“小心轻放”原则。推荐使用小体积晶振产品。

Excessive temperatures or excessive exposure time to high temperatures due to an inappropriate soldering process can also damage the crystal. Make sure the soldering process is compatible with the crystal’s soldering profile.

过高的温度或过长的高温暴露时间也会损坏晶振产品。请确保焊接工艺与晶振焊接说明一致。