关于芯片外部晶振放置位置的说明

关于芯片外部晶振放置位置的说明

SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT  关于芯片外部晶振放置位置,晶诺威科技说明如下:

关于芯片外部晶振放置位置的说明

External Oscillator Pins

Many microcontrollers have options for at least two oscillators: a high-frequency primary oscillator(8MHz~64MHz) and a low-frequency secondary oscillator(RTC 32.768KHz). The oscillator circuit should be placed on the same side of the board as the device. Place the oscillator circuit close to the respective oscillator pins with no more than 0.5 inch (12 mm) between the circuit components and the pins. The load capacitors should be placed next to the oscillator itself, on the same side of the board.

通常情况下,芯片(MCU/微控制器)至少有两颗晶振需要选择:一颗是高频晶振(8MHz~64MHz),而另外一颗则是低频晶振(RTC 32.768KHz)。 晶振电路应设计在电路板的同一侧。布线时,晶振应尽可能靠近芯片信号引脚(该距离不可超过0.5英寸,即12毫米)。外接的两个匹配负载电容应与晶振放在电路板同一侧,且尽可能靠近晶振。

关于芯片外部晶振放置位置的说明

Use a grounded copper pour around the oscillator circuit to isolate it from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed.

通过铺铜方式将晶振电路与周围电路隔离。请将铺铜区域与MCU接地直连。不要在铺铜区域走任何信号线或电源线。另外,如果为双层板,请不要在晶振位置的板子背面走任何信号线。

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